Method of room temperature covalent bonding

ABSTRACT

A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NH 2  species. This may be accomplished by exposing the bonding layer to an NH 4 OH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims the benefit of priorityunder 35 U.S.C. §120 from Ser. No. 12/954,735, filed Nov. 26, 2010,which is a continuation of Ser. No. 11/958,071, filed Dec. 17, 2007, nowU.S. Pat. No. 7,862,885, which is a continuation of Ser. No. 11/442,394,filed May 30, 2006, now U.S. Pat. No. 7,335,996, which is a division ofSer. No. 10/440,099, filed May 19, 2003, now U.S. Pat. No. 7,109,092,the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the field of wafer direct bonding atroom temperature, and more particularly to the bonding of substrates forthe fabrication of engineered substrates, encapsulation, andthree-dimensional device integration using the effects of, and combinedeffects of, fluorine and ammonium in dielectrics, especially in asilicon oxide layer.

2. Description of the Related Art

As the physical limits of conventional CMOS device are being approachedand the demands for high performance electronic systems are imminent,system-on-a chip (SOC) is becoming a natural solution of thesemiconductor industry. For system-on-a chip preparation, a variety offunctions are required on a chip. While silicon technology is themainstay technology for processing a large number devices, many of thedesired circuit and optoelectronic functions can now best be obtainedfrom individual devices and/or circuits fabricated in materials otherthan silicon. Hence, hybrid systems which integrate non-silicon baseddevices with silicon based devices offer the potential to provide uniqueSOC functions not available from pure silicon or pure non-silicondevices alone. One method for heterogeneous device integration has beenthe hetero-epitaxial growth of dissimilar materials on silicon. To date,such hetero-epitaxial growth has realized a high density of defects inthe hetero-epitaxial grown films, largely due to the mismatches inlattice constants between the non-silicon films and the substrate.

Another approach to heterogeneous device integration has been waferbonding technology. However, wafer bonding of dissimilar materialshaving different thermal expansion coefficients at elevated temperatureintroduces thermal stresses that lead to dislocation generation,debonding, or cracking. Thus, low temperature bonding is desired. Lowtemperature bonding is also desired for the bonding of dissimilarmaterials if the dissimilar materials include materials with lowdecomposition temperatures or temperature sensitive devices such as, forexample, an InP heterojunction bipolar transistor or a processed Sidevice with ultrashallow source and drain profiles.

The design of processes needed to produce different functions on thesame chip containing different materials is difficult and hard tooptimize. Indeed, many of the resultant SOC chips (especially those atlarger integration size) show a low yield. One approach has been tointerconnect fully processed ICs by wafer adhesive bonding and layertransfer. See for example Y. Hayashi, S. Wada, K. Kajiyana, K. Oyama, R.Koh, S Takahashi and T. Kunio, Symp. VLSI Tech. Dig. 95 (1990) and U.S.Pat. No. 5,563,084, the entire contents of both references areincorporated herein by reference. However, wafer adhesive bondingusually operates at elevated temperatures and suffers from thermalstress, out-gassing, bubble formation and instability of the adhesive,leading to reduced yield in the process and poor reliability over time.The adhesive may also be incompatible with typical semiconductormanufacturing processes. Moreover, adhesive bond is usually nothermitic.

Room temperature wafer direct bonding is a technology that allows wafersto be bonded at room temperature without using any adhesive resulting ina hermitic bond. It is not prone to introduce stress and inhomogeneityas in the adhesive bonding. Further, if the low temperature bonded waferpairs can withstand a thinning process, when one wafer of a bonded pairis thinned to a thickness less than the respective critical value forthe specific materials combination, the generation of misfitdislocations in the layer and sliding or cracking of the bonded pairsduring subsequent thermal processing steps are avoided. See for exampleQ. Y. Tong and U. Gosele, Semiconductor Wafer Bonding: Science andTechnology, John Wiley & Sons, New York, (1999), the entire contents ofwhich are incorporated herein by reference.

SUMMARY OF THE INVENTION

The present invention is directed to a bonding method including formingfirst and second bonding layers on respective first and second elements,at least one of the bonding layers comprising a fluorinated oxide layer,bringing into contact the first and second bonding layers in ambient atroom temperature, and forming a bond between said first and secondlayers at room temperature.

Forming at least one of said bonding layers comprising a fluorinatedoxide layer may include forming an oxide layer and exposing the layer toa fluorine-containing solution, vapor or gas.

The method of forming a bonded structure according to the invention mayalso include bonding first and second bonding layers, and forming afluorine concentration having a first peak in the vicinity of aninterface between the first and second bonding layers and a second peakin at least one of said first and second layers separated from the firstpeak and located a distance from the first peak. One of the bondinglayers may be an oxide layer, and the method may further includeintroducing fluorine into the oxide layer, and forming a second oxidelayer on the first oxide layer after the introducing step.

The present invention is also directed to a bonded structure havingfirst and second elements, first and second bonding layers respectivelyformed on the first and second elements, the first bonding layernon-adhesively bonded to the second bonding layer and the first bondinglayer comprises a fluorinated oxide. In the structure the first bondinglayer may comprise a first oxide layer formed on a second oxide layer,where a fluorine concentration in the first bonding layer has a firstpeak located in the vicinity of an interface between the first andsecond bonding layers and a second peak located at an interface betweenthe first and second oxide layers.

It is an object of the present invention to achieve a very high densityof covalent bonds at room temperature in air on the surface of siliconoxide covered wafers of a wide variety of materials.

A further object of the present invention is to reduce the density of asurface silicon oxide layer having a thickness of nm to μm.

A still further object of the present invention is to enhance thediffusion rate of impurities and/moisture absorption away from a bondinterface.

Another object of the present invention is to obtain a bonding layer (nmto μm in thickness) having a Fluorine concentration greater than 1×10¹⁷cm⁻³ on the surface.

An additional object of the present invention is to vary the density ofcovalent bonds across a bonding interface over the surface of anIntegrated Circuit or device pattern using standard semiconductorprocess(es).

Another object of the present invention is to form a low-k dielectriclocally or wholly on a silicon oxide surface with a fluorinationtreatment by standard semiconductor process(es).

A still further object of the present invention is to create a materialwhose surface can be atomically terminated with a desired group suchthat covalent bonds are formed when two such surfaces are brought intocontact at room temperature.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present invention and many attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIG. 1 is a flow diagram of an embodiment of the method according to theinvention;

FIG. 2A is a diagram of a pair of unbonded substrates having respectivebonding layers;

FIG. 2B is a diagram of a pair of unbonded substrates brought intodirect contact;

FIG. 2C is a diagram of the pair of substrates in FIG. 2B after aportion of the substrate is removed;

FIG. 2D is a diagram of the pair of substrates of FIG. 2C after bondinga third substrate;

FIG. 3 is a graph of bonding energy as a function of storage time atroom temperature in air of bonded wafer pairs with and without a bondinglayer involving fluorine and ammonium;

FIG. 4 is a graph of bonding energy as a function of storage time forbonded wafers processed with and without plasma treatment;

FIG. 5 is a graph of bonding energy at room temperature as a function oftime for wafer pairs treated with and without ammonium;

FIG. 6 is a graph of room temperature bonding energy as a function of apost-HF treatment baking temperature;

FIG. 7 is a graph illustrating the linear relation of the measuredbonding energy and square root of storage time;

FIGS. 8A-8C illustrate an embodiment of the invention where afluorinated layer is formed in a bonding layer;

FIGS. 9A-9E show schematically localized fully covalent bonding regionsin a bonded wafer pair;

FIG. 10 is a micrograph depicting the fractured Si subsurface beneaththe bonded interface of the present invention;

FIG. 11 is a diagram of an embedded low-k oxide structure;

FIG. 12 is a SIMS (Secondary Ion Mass Spectroscopy) measurement;

FIG. 13 illustrates bonding a plurality of devices to a largersubstrate;

FIGS. 14A-14C depict schematically an application of the bonding processof the present invention to metal to metal bonding;

FIG. 15 illustrates metal to metal bonding of a plurality of devices toa larger substrate; and

FIGS. 16A-16E illustrate an application of the invention to hermiticencapsulation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to the drawings, wherein like reference numerals designatelike or corresponding parts throughout the several views, and moreparticularly to FIGS. 1 and 2A-2B illustrating a first embodiment of thebonding process of the present invention is described. FIG. 1illustrates in general terms the method according to the invention.Bonding layers are formed on an element to be bonded, such as asubstrate or wafer (STEP 10). At least one of the bonding layers isfluorinated by, for example, exposing its surface to fluorine orfluorine implantation (STEP 11). The layers are brought into directcontact, forming a bonding interface, (STEP 12) and covalent bonds formas a result of a chemical reaction (STEP 13). The strength of the bondincreases with time as additional covalent bonds form and/or byproductsfrom said chemical reaction diffuse away from said bonding interface.Preferably, the bonding process is conducted at room temperature, about20-25° C.

FIG. 2A shows two wafers 200, 203 having respective bonding layers 201,204 with respective opposing surfaces 202, 205. Bonding layers 201 and204 are composed of silicon oxide formed by any one or combination of anumber of techniques including but not limited to sputtering, plasmaenhanced chemical vapor deposition or thermal oxide. The surfaces ofmaterials 201 and 204 may be relatively rough (>20 Å RMS) and requiresmoothing before being brought into direct contact. The film also mayhave sufficiently low surface roughness to bond without smoothing.Surfaces 202 and 205 may be prepared utilizing techniques described inapplication Ser. Nos. 09/410,054, 09/505,283 and 09/532,886, to producea smooth, activated surface. In brief, the surfaces of the bondinglayers are polished to a small surface roughness, if needed, and thebonding layers are exposed to a fluorinating treatment like diluteaqueous HF, CF₄ or SF₆ plasma treatment, F⁺ implantation, heated, ifrequired, to fluorinate all or a desired part of the bonding layers,activated, and terminated with desired groups on the surface. Theactivation and termination steps may be carried out together. Only oneor both of the bonding surfaces may be so treated. The surfaces 202 and205 are brought together into direct contact, as shown in FIG. 2B, toform a bonded structure. Covalent bonding occurs across the interface206 at room temperature between the two surfaces 202 and 205. Thestrength of the bond within said bonded structure increases with time asthe number of covalent bonds increase and/or reaction byproductsresulting from the bringing together of said terminated surface(s)diffuse away from said bonding surfaces after said bonding surfaces arebrought into direct contact.

Example

In a first example of the first embodiment, PECVD (Plasma EnhancedChemical Vapor Deposition) silicon dioxide was deposited on single-sidepolished silicon wafers at 200-250° C. The thickness of the PECVD oxideis not critical and was arbitrarily chosen as ˜1.0 μm. The waferscovered with the PECVD oxide layers were polished to smooth thesurfaces. AFM (Atomic Force Microscopy) was employed to determine theRMS (Root Mean Square) value of surface micro-roughness to be 1-3 Å. Thewafers were cleaned by a modified RCA 1 (H₂O:H₂O₂:NH₄OH=5:1:0.25)solution and spin-dried.

The wafers were divided arbitrarily into several groups with each waferpair in a group treated in a specific way prior to bonding. In Group I,the oxide covered wafer pairs were treated in an oxygen plasma forthirty seconds in an reactive ion etch mode (RIE) at 100 mTorr. Theplasma treated wafers were dipped in CMOS grade ammonium hydroxideaqueous solution containing 35% ammonia, termed “NH₄OH” hereafter,before being spin-dried and bonded in air at room temperature. In GroupII, the oxide covered wafers were dipped in 0.025% HF aqueous solutionfor 30 seconds and spin-dried. The HF concentration may vary accordingto the type of silicon oxide used and can be from 0.01% to 0.5%. Thewafers were then heated in air at 250° C. for 2-10 h. The wafers werecleaned again in RCA 1, oxygen plasma treated, dipped in NH₄OH andspin-dried before bonded in air at room temperature.

FIG. 3 shows the bonding energy as a function of storage time at roomtemperature in air of the bonded wafer pairs of Group I and II,respectively. The bonding energy of wafer pairs in Group II increasesquickly to 1000 mJ/m² within 3 hr and reaches the fracture energy ofbulk silicon (2500 mJ/m²) after ˜40 hr storage in air at roomtemperature and is significantly higher than the Group I wafer pairs.This is shown by the upper curve in FIG. 3. The HF dip and subsequentheating prior to room temperature bonding produce a large difference inbonding energy at room temperature between Group I and Group II bondedwafers.

To determine the effect of the oxygen plasma treatment in enhancing thebonding energy at room temperature, another group (Group III) of waferswas prepared. The oxide covered wafer pairs in Group III were bonded atroom temperature after the same process conditions as wafer pairs inGroup II except that the oxygen plasma treatment step was omitted. Asimilar bonding energy was realized at room temperature for wafer pairswith and without plasma treatment as shown in FIG. 4. FIG. 4 indicatesthat the oxygen plasma treatment is not essential for the full chemicalbonding at room temperature if wafer bonding is preceded by an HFaqueous dip and bake.

In a further group, Group IV, the oxide covered wafer pairs were bondedat room temperature after the same process conditions as wafer pairs inGroup II except that the step of NH₄OH dip was eliminated and replacedby de-ionized water rinse. FIG. 5 shows that the bonding energy at roomtemperature is reduced by 60% for wafer pairs without NH₄OH dip, 1051mJ/m² versus 2500 mJ/m². The NH₄OH dip thus significantly increases thebonding energy at room temperature.

The NH₄OH treatment terminates the surface with NH₂ groups. Preferably,thus, in the method according to the invention NH₂ groups are terminatedon the surface. This can be accomplished by exposure to aNH₄OH-containing gas, exposure to a NH₄OH-containing plasma, exposure toa NH₄OH-containing liquid vapor or exposure to a NH₄OH-containing liquidor combination of above treatments.

Wafer pairs were processed as those in Group II, but the post-HF bakingwas varied. When no baking was used and bonded wafers were stored in airat room temperature, a bond energy ˜1000 mJ/m² was obtained. Theincrease in room temperature bonding energy as a function of a post-HFbaking temperature for 10 hours of these wafer pairs is shown in FIG. 6.There is a temperature range for post-HF, pre-bonding baking in which amaximum room temperature bonding energy is achieved. The optimal resultswere obtained for a bake at about 250° C. Thus, in the method accordingto the invention the heating is preferably carried out at about 250° C.

The above results indicate, from the resultant high bond strengths, thateach of the HF dip, the post-HF baking, and the NH₄OH dip of theoxide-covered wafers contributes to chemical bonding at roomtemperature.

It is known in the art that adding fluorine into silicon dioxide canlower the oxide density and create micro-voids in the oxide network (seefor example S. Lee and J W. Park, J. Appl. Phys. 80(9) (1996) 5260, theentire contents of which are incorporated herein by reference).Recently, V. Pankov et al., J. Appl. Phys. 86 (1999) 275, and A. Kazoret al., Appl. Phys. Lett. 65 (1994) 1572, the entire contents of whichare incorporated herein by reference, have reported that fluorineincorporation causes Si—O—Si ring breaking and changes of the silicondioxide network structure towards large size rings with lower densityvia the following reaction:

Si—O+F→Si═F+O+1.1 eV  (1)

This modified structure facilitates a higher diffusion rate ofimpurities and enhanced moisture absorption. Furthermore, it is wellknown that fluorinated silicon dioxide (SiOF) absorbs water effectivelywhen it is exposed to humid atmosphere. V. Pankov, J. C. Alonso and A.Ortiz, J. Appl. Phys. 86 (1999), p. 275, the entire contents of whichare incorporated herein by reference.

During a HF dip such as the dip in 0.025% HF aqueous solution of thepresent invention, in addition to the formation of Si—F and Si—OH groupson the silicon dioxide surface, some F ions are also generated asfollows:

2HF+H₂OH₃O ⇄HF₂ ⁻

Si—OH+HF₂ ⁻→Si—F—F⁻+H²O  (2)

See for example H. Nielsen and D. Hackleman, J. Electrochem. Soc. Vol.130 (1983) p. 708, the entire contents of which are incorporated hereinby reference. The post-HF baking at elevated temperatures helps removewater that is generated by the above reaction and enhances the fluorinediffusion. Fluorine atoms diffuse into the oxide and react with Si—O—Sibonds to form SiOF according to Eq. (1).

A higher temperature post-HF bake could possibly produce a thicker SiOFlayer on the oxide surface leading to a higher bonding energy at roomtemperature due to higher efficiency of water absorption. However, theresults in FIG. 6 for baking temperature up to 350° C. show that, whenthe post HF baking temperature is higher than 300° C., the resultantbonding energy is actually lower than that baked at lower temperatures.Chang et al., Appl. Phys. Lett. vol. 69 (1996) p. 1238, the entirecontents of which are incorporated herein by reference, have reportedthat if an SiOF deposition temperature is higher than 300° C., themoisture resistance of the layer starts to increase due to loss of thefluorine atoms in the oxide. Therefore, the reduction of the bondingenergy at room temperature for wafer pairs that were post-HF annealed at350° C. prior to bonding may be attributed to the fact that the SiOFlayers at the bonding interface absorb less moisture than that of 250°C. annealed layers even though the SiOF layer may be thicker.

In a preferred process of the present invention, the outermost surfacetermination of silicon dioxide is converted from Si—F after post-HFannealing to Si—OH after a RCA 1 solution cleaning by the exchangereaction:

Si—F+HOH→Si—OH+HF  (3)

Most Si—H groups are then converted to Si—NH₂ after an, for example,aqueous NH₄OH dip (that contains about 65% H₂O):

Si—OH+NH₄OH →Si—NH₂+2HOH  (4)

However, the surface is still partially terminated in OH groups afterthe NH₄OH dip due to the H₂O content in the NH₄OH.

The Si—NH₂ and Si—OH terminated surfaces are bonded at room temperatureand the following reactions take place when the two surfaces are insufficient proximity:

Si—NH₂+Si—NH₂Si—N—N—Si+H₂  (5)

Si—OH+HO—SiSi—O—Si+HOH  (6)

For example, Q. Y. Tong and U. Goesele, J. Electroch. Soc., 142 (1995),p. 3975 have reported that Si—O—Si covalent bonds can be formed betweentwo Si—OH groups that are hydrogen bonded on opposite bondinghydrophilic surfaces at room temperature. However, the abovepolymerization reaction is reversible at temperatures less than ˜425° C.See for example M. L. Hair, in Silicon Chemistry, E. R. Corey, J. Y.Corey and P. P. Gaspar, Eds, Wiley, New York, (1987), p. 482, the entirecontents of which are incorporated herein by reference.

If the water and hydrogen generated by the above reactions can beremoved without heat, the covalent bonds become not subject toreversibility according to the above reactions and permanent covalentbonding at room temperature results. According to the present invention,by fluorinating the oxide before bonding, fluorine is incorporated intothe oxide away from the bonding interface and the by-product water ofthe above polymerization reaction can be absorbed by diffusing from thebonding interface into the low density fluorinated oxide away from thebonding interface, leading to a high degree of covalent bonding acrossthe interface at room temperature. The bonding energy as a function ofthe square root of storage time at room temperature is shown in FIG. 7for oxide covered wafer pairs bonded at room temperature using the sameprocess conditions as those in Group II. For a constant total amount ofwater S, the water concentration at the bonding interface C_(s1) isreversibly proportional to the square root of time t and water diffusioncoefficient D₁ and the hydrogen concentration at the bonding interfaceC_(s2) is reversibly proportional to the square root of time t andhydrogen diffusion coefficient D₂:

C _(s1) =S/(πD _(1t))^(1/2)  (7.1)

C _(s2) =S/(πD _(2t))^(1/2)  (7.2)

See for example J. C. C. Tsai, in VLSI Technology, S. M. Sze, Ed,McGraw-Hill, Auckland, (1983), p. 147, the entire contents of which areincorporated herein by reference.

As the bonding energy γ is reversibly proportional to the water andhydrogen concentration at the bonding interface, the bonding energyshould proportional to the inverse of the hydrogen and waterconcentration at the interface:

(Cs ₁ +Cs ₂)⁻  (8)

Although the concentration of NH₂ termination may be greater than OHtermination resulting in a higher concentration of H₂ than H₂O afterbonding, the diffusivity of hydrogen is expected to be significantlyhigher than that of water due to its much smaller size (2.5 Å vs. 3.3Å). The increase in bond energy may then be dominated by the diffusionof water and be proportional to the square root of time if the diffusioncoefficient is a constant:

1/Cs ₁=(πD _(1t))^(1/2) /S  (9)

Consistent with this understanding, an approximate linear relation ofthe measured bonding energy vs. square root of storage time is observed,as shown in FIG. 7, is consistent with water (and hydrogen) diffusionaway from the bonding interface into the fluorinated oxide layer. Thus,the diffusion of water (and hydrogen) away from the bond interface islikely responsible for the enhancement of the bonding energy observed inthe present invention, but the present invention is not limited toreactions that result in water byproducts and the diffusion of saidwater (and hydrogen) byproducts away from said bond interface.

For a bonding surface that is terminated primarily with OH groups, forexample one not treated with NH₄OH as, for example, the wafers in GroupIV, there is a substantially higher concentration of H₂O to diffuse awayfrom the interface. Therefore, the bonding energy of wafer pairs withNH₄OH dip increases quickly with storage time and reaches a much highervalue than that of wafer pairs without NH₄OH dip as shown in FIG. 5.

A method of fluorinating an oxide layer for use in subsequent bonding isshown in FIGS. 8A-8C. After forming an oxide layer 81 on a substrate tobe bonded 90 (FIG. 9A), the oxide is exposed to HF either by a wetprocess or by a gaseous process. An example of a gaseous process isexposure of the wafer surface to HF vapor without immersion in an HFsolution. The oxide may be formed in a number of ways including but notlimited to sputtering, plasma enhanced chemical vapor deposition(PECVD), and thermal growth. The substrate may be a silicon wafer withor without devices formed therein. Alternatively, F may be introducedinto the oxide layer by fluorine ion implantation of 1×10¹⁵ to1×10¹⁶/cm² with energy of 20-30 keV.

After annealing at ˜250° C. a SiOF surface bonding layer 83 of about 0.5μm thick is formed in the surface 82 of layer 81 (FIG. 8B). It is notedthat the dimensions of layer 83 are not shown to scale. The substrate isready for bonding to another substrate 84 having a second bonding layer85 also having an SiOF layer 86 formed in the surface, the bonding ableto be performed in ambient at room temperature, as shown in FIG. 8C. Avery high density of covalent bonds that is higher by a factor of up to2.5 than pairs bonded using no HF dip and bake (as inferred by measuredbond strength) is formed between the substrates at room temperature.

It is also possible to bond the SiOF surface layer to another bondinglayer without an SiOF surface layer. It is also possible to form SiOFsurface layers by F+ implantation and/or etching (for example dryetching using SF₆ and/or CF₄) of silicon oxide followed by baking at anelevated temperature. It is further possible to form SiOF surface layersby PECVD (Plasma-Enhanced Chemical Vapor Deposition). For example,electron-resonance PECVD oxide deposition using SiF₄/Ar/N₂O at roomtemperature (S. P. Kim, S. K. Choi, Y. Park and I Chung, Appl. Phys.Lett. 79 (2001), p. 185, PECVD oxide deposition using Si₂H₆/CF₄/N₂O at120° C., J. Song, P. K. Ajmera and G. S. Lee, Appl. Phys. Lett. 69(1996), p. 1876 or SiF₄/O₂/Ar at 300° C. S. Lee and J. Park, Appl. Phys.Lett. 80 (1996), p. 5260.

The HF-dip and annealing to form the SiOF surface bonding layer onsilicon dioxide surface has unique applications. FIGS. 9A-E showschematically that the present invention can be used to produce alocalized variation in covalent bonding and hence bond energy across asurface. FIG. 9A shows that, at the selected regions of exposed silicondioxide on a silicon wafer, in this case the silicon device regions, adilute HF (or buffered HF) solution is used to etch a small amount ofoxide from the surface. Substrate 90 has a silicon dioxide layer 91 anda device portion 92. The device portion could be a discrete device, acircuit or an integrated circuit. Photoresist or masking layer 93 isformed on oxide 91 having an aperture 94. The dilute HF solution etchesthe silicon dioxide exposed by aperture 94 to create recessed area 95.The recessed area may have a very wide range of depth from a few nm tomany microns, although thicker depths are also possible (FIG. 9B). Thephotoresist or masking layer is resistant to etching by HF. Layer 93 isremoved, followed by, as shown in FIG. 9C, deposition of silicon dioxideat ˜250° C. across the entire surface. The 250° C. re-deposition processmimics in effect the post-HF baking treating and buries the dilute HFtreated surface.

A CMP process step may then be used to planarize the recessed area andimprove the surface roughness. A Group I surface treatment is thenapplied to layer 96, and the silicon wafer is bonded at room temperatureto another wafer, such as a silicon dioxide layer 97 covering wafer 98,as shown in FIG. 9D. The room temperature bonding energy at the HFetched regions is then significantly higher than the non-HF etchedregions along the bonding interface according to the present invention.

When a bonded pair so formed is forcibly separated, the resultingseparation is typically not at the bonding interface of the HF dippeddevice region. Instead, a part of the silicon wafer or the silicon waferitself may fracture beneath the bonded interface and peel from thesubstrate, as shown schematically in FIG. 9D. Portion 99 of substrate 90is attached to device or circuit 92. Portion 100 of layer 91 and portion101 of layer 96 are separated by the fracture (FIG. 9E).

A physical example of the FIG. 9 schematic is shown in the micrograph ofFIG. 10 that shows the remnant of a wafer from a bonded pair that wasforcibly separated. This remnant shows a fracture in a silicon waferbeneath the bonded interface where the surface was exposed to HF. Thisis consistent with the bonding energy between silicon oxide layers inthese locations being higher than the fracture energy of bulk silicon.In other locations at the bonding interface of the wafer pair, alsoshown in FIG. 10, the surface was not exposed to HF. In these locations,the bonding energy is expected to be lower than the fracture energy ofbulk silicon. This is consistent with the lack of silicon peeling inthese areas.

This localized fluorination may also result in the formation of a lowerk dielectric due to the introduction of F into the oxide which lowersthe dielectric constant of the material. This feature of the presentinvention may be used to advantage in the design of integrated circuitsor other structures. For example, a low k dielectric can be formedbetween the metal lines, but not at the via level in multi-layerinterconnects in VLSI devices, by an etching process, such as exposureto HF, at an area where low k dielectric is desired followed by an oxidedeposition at ˜250° C. FIG. 11 shows an example of an embedded low kstructure. In FIG. 11, low k material layer portions 111 and 113 areformed between oxide layers, such as SiO₂, 110, 112 and 114. Metallayers 115 and 117 are connected by vias 116 and 118.

Example

A second example of the method will be described again using FIGS.8A-8C. A first oxide layer 81 is formed on substrate 80 (FIG. 8A).Fluorine is introduced into film 81 by one of the procedures describedabove, namely, exposure to HF or exposure to a F-containing gas. Asecond oxide film 82 is formed on film 81 by PECVD, for example (FIG.8B). Fluorine is introduced into the second film by diffusion and/orsurface segregation. It may also be introduced into the second film bythe use of an appropriate F-containing precursor for the deposition ofsaid oxide film 82. It is noted that the dimensions of films 81 and 82are not to scale for this example, since the figures were also used todescribe an example where film 82 is formed in the surface of film 81,but the figures do accurately represent the position of films 81 and 82.In this example, the structure does not need to be baked to create afluorinated layer that assists in the removal of reaction byproductsbecause of the deposition temperature and/or F-containing precursorassociated with said oxide film 82. The sample is then ready to bebonded to another wafer as shown in FIG. 8C.

SIMS (Secondary Ion Mass Spectroscopy) measurements were taken on thesample shown in FIG. 10 in the HF exposed surface area of the sampleprocessed where a silicon oxide layer is formed and exposed to an HFsolution, followed a deposition of oxide at 250° C. The sample was thendipped in an NH₄OH solution. The measurement is shown in FIG. 12. Theexistence of Si—N covalent bonds at the bonding interface of bondedwafers that were dipped in NH₄OH prior to bonding is confirmed by theSIMS measurement shown in FIG. 12. Furthermore, the SIMS profilemeasurement clearly confirms the existence of a high F concentration inthe vicinity of the oxide deposition interface on the HF etched recess.Since the only HF exposure to this sample was before the oxidedeposition, it is reasonable to attribute the F signal at the bondinginterface to the diffusion of F through the deposited oxide andaccumulation at the oxide surface during the 250° C. oxide deposition.The fluorine concentration at the bonding interface is about 2×10¹⁸/cm³and the peak nitrogen concentration is ˜3.5×10²⁰/cm³. The F located awayfrom the bonding interface facilitates removal of reaction byproducts,such as HOH, resulting in an increased concentration of permanentcovalent bonds and bond strength.

The post-HF aqueous dip bake of 10 hours at 250° C. is comparable to thetemperature and duration of iterated PECVD oxide deposition. It is thuspossible to avoid a separate annealing step after the HF dip by insteaddepositing a PECVD oxide on the HF treated surface. An example of thisadvantage is in the planarization of a non-planar wafer in preparationfor wafer bonding. For example, the room temperature bonding can be veryuseful for the bonding of integrated circuits (ICs). However, ICstypically have a non-planar surface that is not conducive to the planarand smooth surfaces preferable for room temperature direct waferbonding. A method for improving this planarity is to deposit an oxidelayer followed by CMP. This is similar to the example provided abovewith the exception that the non-planarity may be 1 micron or more. Inthis case of increased non-planarity, a thicker oxide is deposited ormore than one iteration of oxide deposition and CMP is used to achievethe desired planarity. In this planarization process, if the HFtreatment is applied before the (last) oxide depositions, then thesubsequent oxide deposition will have an increased F concentration and aF accumulation at its surface after the oxide deposition. This Fconcentration can then result in a higher bond energy, for example witha Group I pre-bond treatment as described above, without anypost-oxide-growth heat treatment, than would otherwise be obtained ifthe HF treatment was not used.

The method of the present invention can be carried out in ambientconditions rather than being restricted to high or ultra-high vacuum(UHV) conditions. Consequently, the method of the present invention is alow-cost, mass-production manufacturing technology. The method is alsonot limited by the type of wafer, substrate or element bonded. The wafermay be a bulk material, such as silicon, a wafer having devices formedtherein, a handler substrate, a heat sink, etc.

While FIGS. 2A and 2B show two devices bonded together, the method isnot limited to bonding two devices. One of substrate 200 and 203 may beremoved and the process repeated, as shown in FIGS. 2C and 2D. In FIG.2C the substrate 203 of the structure shown in FIG. 2B is subject tosubstrate removal by a procedure including one or more processes ofgrinding, lapping, polishing and chemical etching, to leave portion 207.The appropriate process or processes may be determined based upon thetype of the materials or the structure subjected to the process orprocesses. In a case where the substrate 203 contains devices or otherelements in its surface, all or essentially all of substrate 203 exceptfor the region where the devices or other elements reside may beremoved. The amount removed can vary based upon the materials, theetching characteristics of the materials, or the details of theparticular application.

Another bonding layer 208 of the same or different material, such as adeposited silicon oxide material is formed on portion 207 (as shown inFIG. 2C) and another substrate 209 with bonding layer 210 is prepared asdescribed above, namely, the surface of layer 210 is smoothed to asurface roughness in the above-mentioned ranges, and bonded to layer 108at interface 211 in the same manner as described above. The resultingstructure is shown in FIG. 2D. The process may be performed N times, asdesired, to produce an (N+1)-integrated structure.

The present invention can bond locally or across an entire wafer surfacearea. In other words, smaller die may be bonded to a larger die. This isshown in FIG. 13 where several smaller die 133, 135 and 137 havingrespective bonding layers 134, 136 and 138 are bonded to surface 132 ofbonding layer 131.

The present invention may also be used in room temperature metal directbonding, as described in application Ser. No. 10/359,608, the contentsof which are herein incorporated by reference. As shown in FIG. 14A, twosubstrates 140 and 143 have respective bonding layers 141 and 144 andmetal pads 142 and 145. Gaps 146 separate the pads and the uppersurfaces of the pads extend above the upper surface of the layers 141and 144. The surface of layers 141 and 144 are prepared for bonding asdiscussed above, and then the metal pads of the substrates are broughtinto contact (FIG. 14B). At least one of the substrates elasticallydeforms and the bonding layers 141 and 144 contact and begin to bond atone or more points of contact between the layers 141 and 144 (FIG. 14C).The bond propagates to form a bond 147. At room temperature, a strongbond (such as a covalent bond) forms.

FIG. 15 shows metal bonding of smaller devices or die 151 and 152 to asingle larger substrate 150. Structures 153 and 154 in devices 151 and152, respectively, may be active devices or contact structures.Structures 156, which may also be or contain active devices, insubstrate 150 have contact structures 155. A bond is formed at interface159 between bonding layer 157 on substrate 150 and bonding layers 158 onthe smaller devices 151 and 152.

The metal direct bonding offers numerous advantages includingelimination of die grinding and thinning, via etching and metaldeposition to form electrical interconnections to interconnect bondedwafers as described in the referenced art. This eliminates anymechanical damage caused by these die grinding and thinning. Further,the elimination of deep via etching avoids step coverage problems,allows the process to be scaled to smaller dimensions, resulting insmaller via plugs to contact bonded wafers. The method is compatiblewith other standard semiconductor processes, and is VLSI compatible.

In a further example, the method of the invention can be applied tohermitic encapsulation as shown in FIGS. 16A-16E. A fluorinated bondinglayer 162 is formed on the carrier, and protected during the formationof a device 161 such as a MEMS. FIG. 16A shows the steps of formingbonding layer 162 on carrier 160, followed by forming protective film163 on bonding layer 162, and forming device 161 on carrier 160. As anexample, carrier 160 could be a silicon substrate and bonding layer 162could be a deposited oxide layer having the appropriate surfaceroughness and planarity characteristics to facilitate room temperaturebonding. As shown in FIG. 16B, film 163 has been removed after theformation of device 161, and a cover 165 having portions 166 withsurfaces 167, prepared with the appropriate surface roughness andplanarity characteristics, in position to be bonded to surface 164 ofbonding layer 162. Surface 167 is brought into direct contact withsurface 164 and bonded, to form bond 169 as shown in FIG. 16C. FIG. 16Drepresents a modification of the method shown in FIGS. 16A-16C wherebonding layer 170 is formed on portions 166, with appropriate surfaceand planarity characteristics. The surface of film 170 is brought intocontact with surface of film 162 and bonded to form bond 171. Anothermodification of the method shown in FIGS. 16A-16C is illustrated in FIG.16E, where the cover consists of plate 172 and portions 173 formed onplate 172. The surfaces of portions 173 are prepared as discussed above,and bonded to film 162 to form bond 174. The right hand portion of FIG.16E shows a further modification where portion 173 is bonded to plate172 with film 174 and to the surface of layer 162 to form bond 175. Ineither instance, portion 173 could be an oxide or silicon material, andplate 172 could be a silicon plate.

According to the present invention, silicon dioxide formed by any methodsuch as deposition, sputtering, thermally or chemically oxidation, andspin-on glass, can be used in pure or doped states.

In a preferred embodiment of the present invention, an ammonia solutiondip of wafers covered by fluorinated surface silicon dioxide layers,after hydration and prior to bonding, significantly increases thebonding energy at room temperature due to the formation of Si—N bondsand hydrogen.

An HF-dip and post-HF baking can produce localized covalent bonding at adesirable location on the wafer such as in an etched window in thesilicon dioxide layer. Alternatively F implantation and subsequentannealing can produce localized covalent bonding at desirable locations.

According to the present invention, the HF-dip and post-HF baking canform low k dielectric locally in silicon dioxide layers. For instance,low k dielectric can be formed between the metal lines but not at thevia level in multi-layer interconnects in VLSI devices.

The method of the invention is applicable to any type of substrate, suchas heat sinks, handler or surrogate substrates, substrates with activedevices, substrates with integrated circuits, etc. Substrates ofdifferent technologies, i.e. silicon, III-V materials, II-VI materials,etc. may be used with the invention.

Applications of the present invention include but are not limited tovertical integration of processed integrated circuits for 3-D SOC,micro-pad packaging, low-cost and high-performance replacement of flipchip bonding, wafer scale packaging, thermal management and uniquedevice structures such as metal base devices.

Numerous modifications and variations of the present invention arepossible in light of the above teachings. It is therefore to beunderstood that within the scope of the appended claims, the inventionmay be practiced otherwise than as specifically described herein.

1. A bonded structure, comprising: first and second elements; first andsecond bonding layers respectively formed on said first and secondelements; said first bonding layer non-adhesively bonded to said secondbonding layer; and said first bonding layer comprising a fluorinatedoxide.